Nova V2600 is a high accuracy, stand-alone optical CD platform that addresses the compound challenges facing the semiconductor manufacturing industry in the production of vertical 3D structures using through-silicon-via technology (TSV). The V2600 extends Nova’s fleet offering to support innovative TSV-based technology nodes and reinforces the company's dedication to developing solutions to emerging technologies.
TSV is a new method for vertical integration, in which conducting pillars are formed within the silicon substrate and later used for direct stacking of chips. This process allows for either larger number of devices per unit (e.g. in memory applications) or the integration of chips to increase hybrid system performance (e.g. sensor, processor and memory).
The Nova V2600 delivers a reliable and high-throughput process control solution for innovative TSV-based 3D structures. The platform uses a technique that combines standard broad spectrum reflectrometry with innovative dark-field (DF) measurement. Using this scheme blocks spectral light reflections from the wafer top, preventing it from reaching the detector. Oblique-angle light reflections from the via side-wall surfaces is passed through for collection by the detector.
By using innovative dark-field measurement techniques, Nova can provide highly accurate, non-destructive measurements of critical TSV characteristics such as side-wall angle and bottom curvature.
Highest throughput solution
Modular Metrology™ platform
Designed for advanced tech nodes
Superior tool-to-tool matching
Extendibility to future metrology
Robust platform – high reliability hardware architecture
Static optics for improved uniformity